Industrial eMMC 5.1 with integrated controller for soldered-down storage in embedded systems exposed to vibration and wide temperatures.
10 GB to 256 GB, up to 310 MB/s read
pSLC mode or 3D TLC, up to 2,000 TBW
Operating temperature −25 to 85 °C or −40 to 85 °C
JEDEC eMMC 5.1 HS400, 153-ball FBGA 11.5 x 13 mm
Firmware power-loss protection and Secure Write Protection
AutoRefresh and Dynamic Data Refresh for data integrity
Command Queuing and field firmware update
| Sector | Cyber Security, Defence, Factory Automation, Infrastructure & Energy, Medical & Life Science, Renewables, Vehicle Solutions |
|---|---|
| Storage | eMMC |
| Form factor | BGA |
| Temperature range | -40°C ~ 85°C |
| Storage interface | eMMC 5.1 |
| Flash type | 3D TLC, pSLC |
| Storage capacity | 10GB, 256GB |
| Sequential read | 310 MB/s |
| Sequential write | 240 MB/s |
| MTBF | 3.000.000 h |
| Dimensions | 11,5 x 13 x 1,2 mm |
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