Key Features
ATP-Built, Characterized and Tested from IC to Module
100% test during burn-in (TDBI)
Available in monolithic 8 Gb one-chip select (1CS)
Available in 8 Gb DDP two-chip select (2CS)
Longevity Support
Available DDR3 Configurations

A typical monolithic DDR3 DRAM chip has a density of 4 Gigabits (Gb). To pack 8 Gb in a monolithic DRAM die, manufacturers
employ a die-stacking method called dual-die package (DDP), which combines two bare memory dies within a single chip package.
Each die has a separate set of control lines where each memory die is separately selectable, and the processor treats the chip as
two components despite being in the same package.

ATP DDR3 components are available in monolithic 8 Gb one-chip select (1CS) or as DDP two-chip select (2CS) for a variety of memory modules based on this technology.

With ATP’s own-built DDR3 modules, the company reaffirms its commitment to continue supporting legacy memory requirements to maximize customers’ infrastructure investments.