— 5th Gen. Intel® Atom™ processor family — COM Express Mini Type 10 module
— 5th Gen. Intel® Atom™ processor family — COM Express Mini Type 10 module — Intel 9th generation (Gen 9) LP graphics — Up to 4k resolution (4096×2160@60Hz) — 4K Codec Decode & Encode for HEVC, H.264, VP8
Evaluation Carrier Board for COM Express® Mini Type 10 modules. To achieve a quick start
Evaluation Carrier Board for COM Express® Mini Type 10 modules. To achieve a quick start with COM Express® congatec offers an evaluation carrier board, which routes all the COM Express® signals to standard interface connectors. Supports COM Express® Mini Type 10.
– 5th Generation Intel Atom®, Intel® Celeron® and Intel® Pentium® Processors &#
– 5th Generation Intel Atom®, Intel® Celeron® and Intel® Pentium® Processors – Low Power CPUs 6 to 12 Watt TDP – Enhanced Intel HD Graphics Generation 9 – Compact design for size-sensitive devices in harsh environments – Long life components for 24/7 embedded use – Two Intel® i210/211 Ethernet controllers allowing for enhanced industrial communication…
Intel® Atom™ Quad Core processor on Qseven — Intel® Atom™ Quad Core processor
Intel® Atom™ Quad Core processor on Qseven — Intel® Atom™ Quad Core processor on Qseven — Intel 9th generation (Gen 9) LP graphics — Up to 4k resolution (4096×2160@60Hz) — 4K Codec Decode & Encode for HEVC, H.264, VP8 — Fast I/Os: SATA3, USB 3.0 and PCIe 2.0
conga-QEVAL/Qseven 2.0 EVALUATION CARRIER BOARD 4x PCIe x1 / 3x PCIe x1 and mini PCIe, 1x
conga-QEVAL/Qseven 2.0 EVALUATION CARRIER BOARD 4x PCIe x1 / 3x PCIe x1 and mini PCIe, 1x SDIO Card Socket Gigabit Ethernet, up to 8x USB 2.0, up to 2x USB 3.0, USB Client, 1xCAN 5.1 Audio, Microphone, Line In, potical S/PDIF Out 2x SATA…
— 7th Generation Intel® Core™ SOC processor — Intel® Gen9 HD Graphics with
— 7th Generation Intel® Core™ SOC processor — Intel® Gen9 HD Graphics with HEVC (H.265) support — Intel® Optane™ memory can be connected via PCI Express Gen 3.0 — Low power consumption (TDP 15W, cTDP 7.5W) — Up to 32 GByte dual channel DDR4 memory — COM Express Compact Type 6 module 95×95 mm²
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.0 To achieve a quick star
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.0 To achieve a quick start with COM Express® congatec offers an evaluation carrier board, which routes all the COM Express® signals to standard interface connectors. Supports COM Express® Compact and Basic modules using connector Pinout Type 6.
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 2.1 To achieve a quick star
Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 2.1 To achieve a quick start with COM Express® congatec offers an evaluation carrier board, which routes all the COM Express® signals to standard interface connectors. Supports COM Express® Compact and Basic modules using connector Pinout Type 6.
— 7th Generation Intel® Core™ processor — Intel® Xeon® processors for dat
— 7th Generation Intel® Core™ processor — Intel® Xeon® processors for data center applications — Intel® Optane™ memory can be connected via PCI Express Gen 3.0 — ECC memory support — Up to 32 GByte dual channel DDR4 memory
– 8th Generation Intel® Core™ processor serieswith up to 6 cores – Intel®
– 8th Generation Intel® Core™ processor serieswith up to 6 cores – Intel® Xeon® processors for data center applications – Support for USB 3.1 Gen2 with 10Gb/s – Up to 64 GByte dual channel DDR4 memory – ECC memory support
To achieve a quick start with COM Express Type 7 modules congatec offers an evaluation car
To achieve a quick start with COM Express Type 7 modules congatec offers an evaluation carrier board, which routes all the signals to standard interface connectors.
Onboard 13th Gen. Intel® Core™ Series Processor, TDP 15W Onboard LPDDR5x up to 16GB HDM
Onboard 13th Gen. Intel® Core™ Series Processor, TDP 15W Onboard LPDDR5x up to 16GB HDMI 1.4b x 1, eDP x 1 2.5GbE RJ45 x 1, GbE RJ45 x 1 USB 3.2 Gen 2 x 2, USB 2.0 x 4 M.2 2280 M-Key x 1 (PCIe [x2]), PCIe Gen 3 [x4] via FPC x 1 DC…
Extremely compact embedded CPU module in credit card dimensions. Perfectly suited as centr
Extremely compact embedded CPU module in credit card dimensions. Perfectly suited as central computing unit due to cost optimized design without graphics controller. Low power dissipation of ca.3-4 Watt (@600 MHz). 0-60°C operating Temperature. Extended Temperature without cooling solution -40…+70°C. Conformal Coating possible. Passive cooling meeting the requirements for fanless design (@ 600 MHz). Full…
Diamond-MM has all the primary features you expect in a high-performance analog I/O board,
Diamond-MM has all the primary features you expect in a high-performance analog I/O board, at a reduced price. The analog input circuit uses a 12- bit A/D converter and can be configured for single-ended or differential mode and unipolar or bipolar mode. It also offers 10 different input ranges, so it can work with a…
The DS-MPE-CAN2L is a rugged, low cost dual port CAN 2.0 PCIe MiniCard module that is idea
The DS-MPE-CAN2L is a rugged, low cost dual port CAN 2.0 PCIe MiniCard module that is ideal for CAN expansion in embedded and OEM applications. The module implements a CAN protocol bus controller that performs serial communications according to the CAN 2.0A and CAN 2.0B specifications. The protocol uses a multi-master bus configuration for the…
The DS-MPE-DAQ0804 is a rugged, low cost data acquisition PCIe MiniCard module with both a
The DS-MPE-DAQ0804 is a rugged, low cost data acquisition PCIe MiniCard module with both analog and configurable digital I/O. It is ideal for adding analog I/O and digital I/O features to embedded and OEM applications requiring low cost, small size, and/or light weight. The DS-MPE-DAQ0804 offers 8 16-bit analog input channels, 4 16-bit analog output…
The DS-MPE-GE210 is a rugged, low cost Gigabit Ethernet PCIe MiniCard module that is ideal
The DS-MPE-GE210 is a rugged, low cost Gigabit Ethernet PCIe MiniCard module that is ideal for adding an extra Ethernet port to any system in embedded and OEM applications. It provides a convenient, compact, cost-effective means to add an extra gigabit Ethernet port to your embedded system. The Intel 210IT Ethernet controller provides 10/100/1000Mbps operating…
The DS-MPE-GPIO is a rugged, low cost 36-channel digital I/O PCIe MiniCard module that is
The DS-MPE-GPIO is a rugged, low cost 36-channel digital I/O PCIe MiniCard module that is ideal for digital I/O expansion in embedded and OEM applications. An FPGA provides 36 buffered digital I/O lines that can be configured to operate in simple I/O mode in the form of 8-bit and 4-bit ports, or in counter/timer and…
Description The DS-MPE-SER4M is a rugged, low cost 4-port high speed PCIe MiniCard module
Description The DS-MPE-SER4M is a rugged, low cost 4-port high speed PCIe MiniCard module that is ideal for serial I/O expansion in embedded and OEM applications. It offers four RS-232/422/485 serial ports in the PCIe MiniCard full size form factor with an extended operating temperature of -40°C to +85°C. Data rates on every port are…
Description The DS-MPE-SER4OPT is a rugged, low cost 4-port opto-isolated PCIe MiniCard se
Description The DS-MPE-SER4OPT is a rugged, low cost 4-port opto-isolated PCIe MiniCard serial module that is ideal for serial I/O expansion in embedded and OEM applications where opto-isolation is needed for safety or for ground loop prevention. The DS-MPE-SER4OPT offers 4 RS-232/RS-485 opto-isolated serial ports in a PCIe MiniCard form factor. Each port offers 16C550…
Overview Aitech’s E103 convection-cooled VME computer enclosure is built to be rugge
Overview Aitech’s E103 convection-cooled VME computer enclosure is built to be rugged and reliable as well as lightweight and compact. EMI/RFI protected and environmentally sealed, the E103 is capable of withstanding extreme environmental conditions of altitude, temperature, humidity, shock, vibration, EMI and chemical exposure. This makes it ideal for use in all military environments. Sturdy…
Overview The Aitech E104 cold plate conduction-cooled VME computer enclosure is built to b
Overview The Aitech E104 cold plate conduction-cooled VME computer enclosure is built to be rugged and reliable as well as lightweight and compact. EMI/RFI protected and environmentally sealed, the E104 is capable of withstanding extreme environmental conditions of high altitude, temperature, humidity, shock, vibration, EMI and chemical exposure. This makes it ideal for use in…
Overview Aitech’s E105 Fan-cooled VME computer enclosure is built to be rugged and r
Overview Aitech’s E105 Fan-cooled VME computer enclosure is built to be rugged and reliable as well as lightweight and compact. EMI/RFI protected and environmentally sealed, the E105 is capable of withstanding extreme environmental conditions of altitude, temperature, humidity, shock, vibration, EMI and chemical exposure. This makes it ideal for use in all military environments. Sturdy…
Overview Aitech’s E106 Fan-cooled VME computer enclosure is built to be rugged and r
Overview Aitech’s E106 Fan-cooled VME computer enclosure is built to be rugged and reliable as well as lightweight and compact. EMI/RFI protected and environmentally sealed, the E106 is capable of withstanding extreme environmental conditions of altitude, temperature, humidity, shock, vibration, EMI and chemical exposure. This makes it ideal for use in all military environments. Sturdy…
Overview Aitech’s E108 Convection/Radiation cooled VME computer enclosure is built t
Overview Aitech’s E108 Convection/Radiation cooled VME computer enclosure is built to be rugged and reliable as well as lightweight and compact. EMI/RFI protected and environmentally sealed, the E108 is capable of withstanding extreme environmental conditions of temperature, humidity, shock, vibration, EMI and chemical exposure. This makes it ideal for use in harsh locomotive environments. Sturdy…
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